Evaporation System
Features
1-Evaporation Type:
Electron beam evaporation, thermal evaporation, high-frequency induction evaporation, ion source assisted evaporation.
2-Equipment Composition:
Process room, vacuum system, temperature control system, gas transmission system, mechanical system evaporation source, fully automatic program control system, safety system.
3-Application Types:
Metal evaporation and dielectric material evaporation.
4-Optional Configurations:
Quartz crystal film thickness controller, auxiliary ion source (RF source and Hall source), single/multi workpiece automatic sampling chamber, etc.
5-Model: (The model number represents the chamber size)
Metal Evaporation: YEM-450, YEM-700, YEM-800, YEM-900
Medium Film Evaporation: YED-450, YED-700, YED-800, YED-900
Component Characteristics
1-Evaporation source:
Electronic gun, resistance.
2-Film thickness control:
Multi point crystal probe equipped with quartz crystal film thickness controller, integrated into the main control system for control.
3-Temperature control:
Heating on resistance wire、heating under halogen lamp.
4-Exhaust system:
Mechanical pump+Roots pump+molecular pump or cold pump.
5-Optional:
Auxiliary ion sources (RF or Hall sources)、automatic injection chamber, etc.
Main Performance Parameters
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Extreme vacuum: better than 5^-7 torr;
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Pumping speed: The pumping time from the atmosphere to 5^-6 torr is less than 40 minutes;
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Heating: Quartz lamp heating method, independent temperature controlheating and cooling cycle machine, etc;
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Coating uniformity: better than ±2%;
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Coating repeatability: better than ±1%.
Film Forming Characteristics
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Large coating area
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Easy maintenance
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Fast sedimentation rate
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High device stability
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Multiple materials can be deposited alternately in the same process
Installation Requirements: